- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Aavid, Thermal Division of Boyd Corporation |
3,006
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK W/TAB BLACK
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Board Level, Vertical | Clip and PC Pin | 2.0W @ 30°C | 4.00°C/W @ 300 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Clip | 3.0W @ 40°C | 4.00°C/W @ 300 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 CLIP-ON W/TABS
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Board Level, Vertical | Clip and Board Locks | 2.0W @ 30°C | 5.00°C/W @ 200 LFM |
