- Series：
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- Type：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 7
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Wakefield-Vette |
243
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 31X31X12MM ELLIPTICAL
|
906 | Top Mount | Square, Fins | 1.220" (30.99mm) | BGA | 0.457" (11.60mm) | - | 3.50°C/W @ 200 LFM | 10.70°C/W | Black Anodized | ||
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|
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Wakefield-Vette |
155
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 31X31X23MM PIN
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906 | Top Mount | Square, Pin Fins | 1.220" (30.99mm) | BGA | 0.892" (22.65mm) | - | 2.40°C/W @ 200 LFM | 9.90°C/W | Black Anodized | ||
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|
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Wakefield-Vette |
339
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 31X31X23MM ELLIPTICAL
|
906 | Top Mount | Square, Fins | 1.220" (30.99mm) | BGA | 0.892" (22.65mm) | - | 2.50°C/W @ 200 LFM | 8.90°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | Rectangular, Fins | 1.000" (25.40mm) | Multiwatt, SIP | 0.500" (12.70mm) | 3.0W @ 40°C | 4.00°C/W @ 300 LFM | 11.50°C/W | Black Anodized | ||
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Wakefield-Vette |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 31X31X12MM PIN
|
906 | Top Mount | Square, Pin Fins | 1.220" (30.99mm) | BGA | 0.457" (11.60mm) | - | 3.40°C/W @ 200 LFM | 12.00°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 31MMX31MMX12.5MM W/O TI
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maxiGRIP, maxiFLOW | Top Mount | Square, Angled Fins | 1.220" (30.99mm) | BGA | 0.492" (12.50mm) | - | 4.30°C/W @ 200 LFM | - | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 31MM X 31MM X 7.5MM
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maxiGRIP, maxiFLOW | Top Mount | Square, Angled Fins | 1.220" (30.99mm) | BGA | 0.295" (7.50mm) | - | 6.90°C/W @ 200 LFM | - | Blue Anodized |
