Descubre los productos 8
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Type Width Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Natural
513102B02500G
Aavid, Thermal Division of Boyd Corporation
6,015
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 W/PINS 1.5"TALL
Board Level, Vertical 1.375" (34.93mm) Bolt On and PC Pin TO-220 0.500" (12.70mm) 8.0W @ 80°C 11.00°C/W
531102B02500G
Aavid, Thermal Division of Boyd Corporation
6,323
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 W/PINS 1.5"TALL
Board Level, Vertical 1.375" (34.93mm) Bolt On and PC Pin TO-220 0.500" (12.70mm) 7.0W @ 70°C 10.40°C/W
513101B00000
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Board Level 1.380" (35.05mm) Bolt On TO-218 0.500" (12.70mm) 8.0W @ 80°C 11.00°C/W
581102B00000
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 2.5W H=1.5" BLK
Board Level, Vertical 0.640" (16.26mm) Bolt On TO-220 0.640" (16.26mm) 3.0W @ 50°C -
533101B02551G
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Board Level, Vertical 1.375" (34.93mm) Clip and PC Pin TO-218, TO-247 0.500" (12.70mm) 8.0W @ 80°C 11.00°C/W
513101B02500G
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Board Level, Vertical 1.375" (34.93mm) Bolt On and PC Pin TO-218, TO-247 0.500" (12.70mm) 8.0W @ 80°C 11.00°C/W
533102B02551G
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Board Level, Vertical 1.375" (34.93mm) Clip and PC Pin TO-220 0.500" (12.70mm) 8.0W @ 80°C 11.00°C/W
411915B02500
Comair Rotron
Consulta
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-
MOQ: 1  MPQ: 1
HEATSINK EXTRUD 12.7X34.9X38.1MM
Board Level, Vertical 1.375" (34.93mm) Bolt On and PC Pin TO-220, TO-202 0.500" (12.70mm) 8.0W @ 80°C -