- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
2,862
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 2.5W BLK W/PINS
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0.640" (16.26mm) | TO-220 | 0.640" (16.26mm) | 3.0W @ 50°C | 16.80°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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0.640" (16.26mm) | TO-220 | 0.640" (16.26mm) | 3.0W @ 50°C | 16.80°C/W | ||
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Comair Rotron |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK EXTRUDED 16X16.5X38.1MM
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0.650" (16.51mm) | TO-220, TO-218 | 0.630" (16.00mm) | 1.0W @ 20°C | - |
