- Material：
-
- Width：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Condiciones seleccionadas:
Descubre los productos 8
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,120
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-218 W/PINS 1.5"TALL
|
- | Board Level, Vertical | Aluminum | 1.650" (41.91mm) | Bolt On and PC Pin | 1.000" (25.40mm) | 10.0W @ 50°C | 2.00°C/W @ 500 LFM | 5.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level | Aluminum | 1.380" (35.05mm) | Bolt On | 0.500" (12.70mm) | 8.0W @ 80°C | 3.00°C/W @ 500 LFM | 11.00°C/W | ||
|
|
|
CUI Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-218, 38
|
HSE | Board Level, Vertical | Aluminum Alloy | 1.638" (41.60mm) | PC Pin | 0.984" (25.00mm) | 12.0W @ 75°C | 3.52°C/W @ 200 LFM | 6.25°C/W | ||
|
|
|
CUI Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-218, 38
|
HSE | Board Level, Vertical | Aluminum Alloy | 1.638" (41.60mm) | PC Pin | 0.984" (25.00mm) | 12.0W @ 75°C | 3.52°C/W @ 200 LFM | 6.25°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level | Aluminum | 1.650" (41.91mm) | Bolt On | 1.000" (25.40mm) | 5.0W @ 30°C | 3.00°C/W @ 200 LFM | 5.00°C/W | ||
|
|
|
CUI Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-218, 38
|
HSE | Board Level, Vertical | Aluminum Alloy | 1.638" (41.60mm) | PC Pin | 0.984" (25.00mm) | 12.0W @ 75°C | 3.79°C/W @ 200 LFM | 6.25°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Aluminum | 1.650" (41.91mm) | Bolt On and PC Pin | 1.000" (25.40mm) | 5.0W @ 30°C | 3.00°C/W @ 200 LFM | 5.00°C/W | ||
|
|
|
CUI Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-218, 38
|
HSE | Board Level, Vertical | Aluminum Alloy | 1.654" (42.00mm) | PC Pin | 0.984" (25.00mm) | 10.8W @ 75°C | 2.29°C/W @ 200 LFM | 6.94°C/W |
