- Series：
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- Type：
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- Material：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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Descubre los productos 5
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Wakefield-Vette |
38,100
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK BGA/PGA 16.5X16.5X8.9
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Penguin | Board Level | Aluminum | Square, Fins | 0.653" (16.59mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.350" (8.89mm) | - | 8.00°C/W @ 500 LFM | Black Anodized | ||
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Wakefield-Vette |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK 100PQFP COMPOSITE
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Deltem | Top Mount | Composite | Square, Pin Fins | 0.650" (16.51mm) | BGA | 0.400" (10.16mm) | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - | ||
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Wakefield-Vette |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK 100PQFP COMPOSITE
|
Deltem | Top Mount | Composite | Square, Pin Fins | 0.650" (16.51mm) | BGA | 0.400" (10.16mm) | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - | ||
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Wakefield-Vette |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 100PQFP COMPOSITE
|
Deltem | Top Mount | Composite | Square, Pin Fins | 0.650" (16.51mm) | BGA | 0.400" (10.16mm) | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - | ||
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Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 100PQFP COMPOSITE
|
Deltem | Top Mount | Composite | Square, Pin Fins | 0.650" (16.51mm) | BGA | 0.400" (10.16mm) | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - |
