- Length：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Diameter | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Diameter | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
7,556
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-92 .72" BLK
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Board Level, Vertical | Rectangular, Fins | 0.602" (15.29mm) | - | TO-92 | 0.720" (18.29mm) | 0.3W @ 20°C | 17.50°C/W @ 400 LFM | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
421
|
3 dias |
-
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MOQ: 1 MPQ: 1
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TO-5 PUSH-ON HEATSINK 6.35MM
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Board Level | Cylindrical | - | 0.318" (8.07mm) ID, 0.500" (12.70mm) OD | TO-5 | 0.250" (6.35mm) | 1.0W @ 60°C | 35.00°C/W @ 200 LFM | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Cylindrical | - | 0.318" (8.07mm) ID, 0.500" (12.70mm) OD | TO-5 | 0.250" (6.35mm) | 1.0W @ 60°C | 35.00°C/W @ 200 LFM | Red Anodized |
