- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level, Vertical | 2.500" (63.50mm) | 1.375" (34.93mm) | TO-220 | 0.500" (12.70mm) | 8.0W @ 60°C | 2.00°C/W @ 800 LFM | ||
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Ohmite |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK W/CLIP - TO-247/TO-264
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M | Top Mount | 1.060" (26.92mm) | 1.350" (34.30mm) | TO-247, TO-264 | 1.520" (38.61mm) | - | - |
