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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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ASSMANN WSW Components |
117
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3 dias |
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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Aluminum | 1.340" (34.04mm) | 1.000" (25.40mm) | Bolt On and Board Mounts | 0.500" (12.70mm) | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Copper | 1.025" (26.04mm) | 1.005" (25.53mm) | Clip and PC Pin | 0.610" (15.49mm) | 1.5W @ 40°C | 5.00°C/W @ 500 LFM |
