Descubre los productos 5
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Type Length Width Attachment Method Package Cooled Height Off Base (Height of Fin) Thermal Resistance @ Forced Air Flow
580200B00000G
Aavid, Thermal Division of Boyd Corporation
4,831
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK 14-16 DIP BLK ANODIZED
Top Mount 0.890" (22.61mm) 0.600" (15.24mm) Press Fit, Slide On 14-DIP and 16-DIP 0.410" (10.42mm) 12.00°C/W @ 200 LFM
506902B00000G
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Board Level 0.700" (17.78mm) 1.250" (31.75mm) Bolt On TO-220 0.375" (9.52mm) 6.00°C/W @ 600 LFM
560200B00000G
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Top Mount 0.890" (22.61mm) 0.600" (15.24mm) Press Fit, Slide On 14-DIP and 16-DIP 0.410" (10.42mm) 12.00°C/W @ 200 LFM
580500B00000G
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK 24-DIP BLK ANODIZED
Top Mount 1.460" (37.08mm) 1.008" (25.60mm) Press Fit, Slide On 24-DIP 0.580" (14.73mm) 6.00°C/W @ 400 LFM
580200W00000G
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Top Mount 0.890" (22.61mm) 0.600" (15.24mm) Press Fit and PC Pin 14-DIP and 16-DIP 0.410" (10.42mm) 12.00°C/W @ 200 LFM