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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Material | Length | Width | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Material | Length | Width | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Advanced Thermal Solutions Inc. |
2,948
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 CLIPON W/TAB
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Aluminum | 1.500" (38.10mm) | 0.500" (12.70mm) | 0.500" (12.70mm) | - | 7.00°C/W @ 200 LFM | Black Anodized | |||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Copper | 1.025" (26.04mm) | 1.005" (25.53mm) | 0.610" (15.49mm) | 1.5W @ 40°C | 5.00°C/W @ 500 LFM | Tin |
