- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Aavid, Thermal Division of Boyd Corporation |
5,701
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-202 LOW PROFILE .5"
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Board Level | 0.750" (19.05mm) | 0.520" (13.21mm) | Bolt On | 0.500" (12.70mm) | 2.0W @ 50°C | 10.00°C/W @ 200 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | 0.900" (22.86mm) | 0.745" (18.92mm) | Clip | 0.420" (10.67mm) | 1.5W @ 40°C | 6.00°C/W @ 700 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | 0.900" (22.86mm) | 0.745" (18.92mm) | Clip | 0.420" (10.67mm) | 1.5W @ 40°C | 11.00°C/W @ 400 LFM |
