- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Condiciones seleccionadas:
Descubre los productos 2
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|
|
|
Ohmite |
3,241
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-220 2.5"
|
F | Board Level, Vertical | 2.500" (63.50mm) | 1.638" (41.60mm) | Bolt On and PC Pin | TO-220 | 0.984" (25.00mm) | 10.0W @ 50°C | 2.00°C/W @ 300 LFM | ||
|
|
|
Wakefield-Vette |
173
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK POWER NO MNT HOLES BLK
|
401 | Board Level | 1.500" (38.10mm) | 4.750" (120.65mm) | Press Fit | TO-3, Stud Mount | 1.250" (31.75mm) | 30.0W @ 80°C | 1.50°C/W @ 250 LFM |
