- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Wakefield-Vette |
94
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 5.5X5X2.5" POWER/IGBT
|
395 | 5.500" (139.70mm) | 5.000" (127.00mm) | Power Modules | 2.500" (63.50mm) | - | 0.30°C/W @ 500 LFM | ||
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CTS Thermal Management Products |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK PWR .31"H BLACK TO-220
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LB-B1 | 1.400" (35.56mm) | 1.120" (28.45mm) | TO-126, TO-220 | 0.500" (12.70mm) | 1.0W @ 50°C | - |
