- Series:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Condiciones seleccionadas:
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | ||
Apex Microtechnology |
11
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK OPEN FRAME 0.5C/W
|
Apex Precision Power | 9.000" (228.60mm) | 6.620" (168.15mm) | - | 1.780" (45.21mm) | - | - | ||||
Wakefield-Vette |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK NATURAL CONVECTIONC2025
|
476 | 6.000" (152.40mm) | 5.000" (127.00mm) | Stud Mounted Diode | 5.000" (127.00mm) | 50.0W @ 25°C | 0.20°C/W @ 500 LFM |