Fabricante:
Package Cooled:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
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La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Length Width Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow
HS26
Apex Microtechnology
11
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK OPEN FRAME 0.5C/W
Apex Precision Power 9.000" (228.60mm) 6.620" (168.15mm) - 1.780" (45.21mm) - -
476W
Wakefield-Vette
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK NATURAL CONVECTIONC2025
476 6.000" (152.40mm) 5.000" (127.00mm) Stud Mounted Diode 5.000" (127.00mm) 50.0W @ 25°C 0.20°C/W @ 500 LFM