- Material:
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- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Condiciones seleccionadas:
Descubre los productos 3
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | ||
Advanced Thermal Solutions Inc. |
1,096
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/TAB BLACK
|
Aluminum | 1.340" (34.04mm) | 0.800" (20.32mm) | Bolt On and PC Pin | TO-220 | 0.800" (20.32mm) | - | 13.00°C/W | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
983
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 COPPER W/TAB
|
Copper | 0.858" (21.80mm) | 0.520" (13.21mm) | Clip and Board Mounts | TO-220 | 0.510" (12.95mm) | - | 19.70°C/W | Tin | ||||
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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Aluminum | 0.900" (22.86mm) | 1.020" (25.91mm) | Clip and PC Pin | TO-202 | 0.420" (10.67mm) | 3.0W @ 50°C | 16.80°C/W | Black Anodized |