- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Condiciones seleccionadas:
Descubre los productos 3
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | ||
Aavid, Thermal Division of Boyd Corporation |
13,219
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 4.5W H=.5" BLK
|
1.180" (29.97mm) | 1.000" (25.40mm) | 0.500" (12.70mm) | 4.0W @ 80°C | 16.70°C/W | ||||
Aavid, Thermal Division of Boyd Corporation |
10,007
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 BLACK 1.18"
|
1.180" (29.97mm) | 1.000" (25.40mm) | 0.500" (12.70mm) | 4.0W @ 80°C | 16.70°C/W | ||||
Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
0.700" (17.78mm) | 1.250" (31.75mm) | 0.375" (9.52mm) | 1.0W @ 20°C | 20.00°C/W |