- Length：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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Descubre los productos 18
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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CTS Thermal Management Products |
199
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK LOW-PROFILE FORGED
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APF | Top Mount | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | - | ||
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|
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CTS Thermal Management Products |
657
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED W/ADHESIVE TAPE
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APF | Top Mount | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | - | ||
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Wakefield-Vette |
1,661
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/PINS BLK 1.5"
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657 | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 1.500" (38.10mm) | 6.0W @ 38°C | 6.30°C/W | ||
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|
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CTS Thermal Management Products |
1,356
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED W/ADHESIVE TAPE
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APF | Top Mount | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | - | ||
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Advanced Thermal Solutions Inc. |
408
|
3 dias |
-
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MOQ: 1 MPQ: 1
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MAXIGRIP FANSINK 27X27X9.5MM
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fanSINK, maxiGRIP | Top Mount | Square, Pin Fins | 1.063" (27.00mm) | 1.063" (27.00mm) | Clip, Thermal Material | BGA | 0.374" (9.50mm) | - | - | |||
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|
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CTS Thermal Management Products |
80
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3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | - | ||
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|
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Wakefield-Vette |
971
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/PINS BLK 1.5"
|
657 | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 1.500" (38.10mm) | 6.0W @ 38°C | 6.30°C/W | ||
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|
|
Wakefield-Vette |
406
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS BLK 1.5"
|
657 | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 1.500" (38.10mm) | 6.0W @ 38°C | - | ||
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Advanced Thermal Solutions Inc. |
95
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 30MM X 30MM X 19.5MM
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maxiGRIP, maxiFLOW | Top Mount | Square, Angled Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | Clip, Thermal Material | BGA | 0.768" (19.50mm) | - | - | |||
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Wakefield-Vette |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS BLK 1.5"
|
657 | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | Clip and PC Pin | TO-218, TO-220, TO-247 | 1.500" (38.10mm) | 6.0W @ 38°C | - | ||
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|
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CTS Thermal Management Products |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/THERMAL TAPE
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APR | Top Mount | Square, Pin Fins | 1.461" (37.10mm) | 1.461" (37.10mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | - | ||
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Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 42.5 X 42.5 X 19.5MM
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- | Top Mount | Square, Pin Fins | 1.673" (42.49mm) | 1.673" (42.49mm) | Thermal Tape, Adhesive (Included) | BGA | 0.768" (19.50mm) | - | - | |||
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Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 42.5X42.5X19.5MM NO TIM
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- | Top Mount | Square, Pin Fins | 1.673" (42.49mm) | 1.673" (42.49mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.768" (19.50mm) | - | - | |||
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|
|
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS BLK 1.5"
|
657 | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 1.500" (38.10mm) | 6.0W @ 38°C | 6.30°C/W | ||
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|
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CTS Thermal Management Products |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FORGED 38 X 38 X 12MM
|
APR | Top Mount | Square, Pin Fins | 1.461" (37.10mm) | 1.461" (37.10mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | - | ||
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|
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CTS Thermal Management Products |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FORGED WITH SMALL CLIP
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APR | Top Mount | Square, Pin Fins | 1.461" (37.10mm) | 1.461" (37.10mm) | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | - | ||
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|
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CTS Thermal Management Products |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FORGED WITH MEDIUM CLIP
|
APR | Top Mount | Square, Pin Fins | 1.461" (37.10mm) | 1.461" (37.10mm) | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | - | ||
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|
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CTS Thermal Management Products |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FORGED WITH TALL CLIP
|
APR | Top Mount | Square, Pin Fins | 1.461" (37.10mm) | 1.461" (37.10mm) | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | - |
