- Attachment Method：
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- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
Descubre los productos 4
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
5,710
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK 1" TO-220
|
Bolt On and PC Pin | TO-220 | 4.0W @ 30°C | 5.50°C/W | ||
|
|
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Aavid, Thermal Division of Boyd Corporation |
4,500
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-218 SOLDER PIN
|
Bolt On and PC Pin | TO-218 | 12.0W @ 70°C | 5.50°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Bolt On and PC Pin | TO-218 | 12.0W @ 70°C | 5.50°C/W | ||
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|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Clip and PC Pin | TO-220 | 12.0W @ 70°C | 5.70°C/W |
