- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
-
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
8,391
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 PWR BLK W/PINS
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Board Level, Vertical | Bolt On and PC Pin | 2.5W @ 50°C | 17.40°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
2,678
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 4.3W H=1.0 BLK
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Board Level | Bolt On | 2.5W @ 50°C | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Bolt On and PC Pin | 4.0W @ 70°C | 17.40°C/W |
