- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Shape | Length | Width | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Shape | Length | Width | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
1,707
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK TO-3 .750" COMPACT
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Rhombus | 1.880" (47.75mm) | 1.400" (35.56mm) | 0.750" (19.05mm) | 4.0W @ 40°C | 10.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
283
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-3 LOW PROFILE .375"
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Rectangular, Fins | 2.000" (50.80mm) | 1.750" (44.45mm) | 0.375" (9.52mm) | 10.0W @ 70°C | 7.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Square, Fins | 1.780" (45.21mm) | 1.780" (45.21mm) | 0.470" (11.94mm) | 3.0W @ 40°C | 9.40°C/W |
