- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
7,646
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 CLIP-ON BLK
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0.750" (19.05mm) | 1.120" (28.45mm) | TO-220 | 0.440" (11.18mm) | 1.0W @ 20°C | 16.80°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
9,074
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 CLIP-ON
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1.375" (34.93mm) | 0.860" (21.84mm) | TO-220 | 0.395" (10.03mm) | 2.5W @ 40°C | 16.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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0.620" (15.75mm) | 0.845" (21.46mm) | Multiwatt, SIP | 0.380" (9.65mm) | 2.0W @ 50°C | 20.60°C/W |
