- Attachment Method:
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- Thermal Resistance @ Forced Air Flow:
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- Condiciones seleccionadas:
Descubre los productos 3
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Shape | Length | Attachment Method | Thermal Resistance @ Forced Air Flow | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Shape | Length | Attachment Method | Thermal Resistance @ Forced Air Flow | ||
Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Square, Fins | 1.750" (44.45mm) | Bolt On and Board Mounts | 1.50°C/W @ 400 LFM | ||||
Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Rectangular, Fins | 1.840" (46.74mm) | Bolt On and PC Pin | 1.00°C/W @ 700 LFM | ||||
Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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Rectangular, Fins | 1.840" (46.74mm) | Clip and PC Pin | 1.00°C/W @ 700 LFM |