- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 4
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
5,395
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 CLIP-ON BLACK
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Board Level, Vertical | 0.700" (17.78mm) | 0.520" (13.21mm) | TO-220 | 0.510" (12.95mm) | 12.00°C/W @ 300 LFM | 25.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
7,914
|
3 dias |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK .375"TO-220
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Board Level | 0.700" (17.78mm) | 0.900" (22.86mm) | TO-220 | 0.375" (9.52mm) | 14.00°C/W @ 200 LFM | 25.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | 0.620" (15.75mm) | 0.845" (21.46mm) | Multiwatt, SIP | 0.380" (9.65mm) | 6.00°C/W @ 400 LFM | 20.60°C/W | ||
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Comair Rotron |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 9.5X22.8X17.8MM
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Board Level, Vertical | 0.700" (17.78mm) | 0.900" (22.86mm) | TO-220 | 0.375" (9.52mm) | 14.00°C/W @ 200 LFM | - |
