- Material：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 8
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Material Finish | |
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ASSMANN WSW Components |
1,389
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK BLK ANOD ALUM TO-220
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Board Level | Aluminum | 1.500" (38.10mm) | 0.504" (12.80mm) | Press Fit | TO-220 | 0.500" (12.70mm) | 6.00°C/W @ 300 LFM | Black Anodized | ||
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Comair Rotron |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 25.4X12.7X30MM
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Board Level, Vertical | Copper | 1.180" (29.97mm) | 1.000" (25.40mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 6.00°C/W @ 300 LFM | Tin | ||
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Comair Rotron |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 25.4X12.7X30MM
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Board Level, Vertical | Aluminum | 1.180" (29.97mm) | 0.997" (25.33mm) | Clip and PC Pin | TO-220 | 0.500" (12.70mm) | 5.00°C/W @ 400 LFM | Black Anodized | ||
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Comair Rotron |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 25.4X12.7X30MM
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Board Level, Vertical | Aluminum | 0.942" (23.92mm) | 1.000" (25.40mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 4.00°C/W @ 600 LFM | Black Anodized | ||
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Comair Rotron |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 25.4X12.7X30MM
|
Board Level, Vertical | Aluminum | 1.180" (29.97mm) | 1.000" (25.40mm) | Clip and PC Pin | TO-220 | 0.500" (12.70mm) | 6.00°C/W @ 300 LFM | Black Anodized | ||
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Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.4X12.7X30MM
|
Board Level, Vertical | Aluminum | 1.180" (29.97mm) | 1.000" (25.40mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 5.00°C/W @ 400 LFM | Black Anodized | ||
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|
|
Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.4X12.7X30MM
|
Board Level, Vertical | Copper | 1.180" (29.97mm) | 1.000" (25.40mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 6.00°C/W @ 300 LFM | Black Paint | ||
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Comair Rotron |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK EXTRUDED 16X16.5X38.1MM
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Board Level, Vertical | Aluminum | 1.500" (38.10mm) | 0.650" (16.51mm) | Bolt On and PC Pin | TO-220, TO-218 | 0.630" (16.00mm) | 5.00°C/W @ 200 LFM | Black Anodized |
