- Series:
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- Type:
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- Material:
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- Attachment Method:
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- Thermal Resistance @ Forced Air Flow:
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- Condiciones seleccionadas:
Descubre los productos 3
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | ||
Wakefield-Vette |
1,000
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
ANCHOR HEATSINK 35X35X15MM
|
Wave 3x | Board Level | Aluminum Alloy | 1.378" (35.00mm) | 1.378" (35.00mm) | Clip | BGA | 3.15°C/W @ 200 LFM | ||||
Advanced Thermal Solutions Inc. |
66
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 45MM X 45MM X 15MM
|
maxiFLOW | Top Mount | Aluminum | 1.772" (45.00mm) | 1.772" (45.00mm) | Thermal Tape, Adhesive (Included) | ASIC | 2.40°C/W @ 200 LFM | ||||
Advanced Thermal Solutions Inc. |
92
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 45MM X 45MM X 15MM
|
maxiFLOW | Top Mount | Aluminum | 1.772" (45.00mm) | 1.772" (45.00mm) | Thermal Tape, Adhesive (Not Included) | ASIC | 2.40°C/W @ 200 LFM |