- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Material | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Material | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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CUI Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220/TO-
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HSE | Aluminum Alloy | 0.650" (16.50mm) | PC Pin | TO-218, TO-220 | 5.9W @ 75°C | 4.44°C/W @ 200 LFM | 12.71°C/W | ||
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Comair Rotron |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK EXTRUDED 16X16.5X38.1MM
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- | Aluminum | 0.650" (16.51mm) | Bolt On and PC Pin | TO-220, TO-218 | 1.0W @ 20°C | 5.00°C/W @ 200 LFM | - |
