- Series:
-
- Attachment Method:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
Descubre los productos 6
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | ||
Advanced Thermal Solutions Inc. |
193
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 21MM X 9.5MM
|
- | Square, Fins | Thermal Tape, Adhesive (Included) | 0.3W @ 20°C | 20.20°C/W @ 200 LFM | ||||
Advanced Thermal Solutions Inc. |
128
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 21MM X 9.5MM
|
- | Square, Fins | Thermal Tape, Adhesive (Included) | - | 21.90°C/W @ 200 LFM | ||||
Advanced Thermal Solutions Inc. |
33
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 21MM X 9.5MM
|
maxiGRIP, maxiFLOW | Square, Angled Fins | Clip, Thermal Material | - | 12.00°C/W @ 200 LFM | ||||
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 21X21X9.5MM W/OUT TIM
|
- | Square, Fins | Thermal Tape, Adhesive (Not Included) | 0.3W @ 20°C | 20.20°C/W @ 200 LFM | ||||
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 21X21X9.5MM W/OUT TIM
|
- | Square, Fins | Thermal Tape, Adhesive (Not Included) | - | 21.90°C/W @ 200 LFM | ||||
Advanced Thermal Solutions Inc. |
18
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 21MM X 9.5MM
|
maxiGRIP | Square, Fins | Clip, Thermal Material | - | 20.20°C/W @ 200 LFM |