- Series：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
Descubre los productos 3
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Attachment Method | Power Dissipation @ Temperature Rise | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Attachment Method | Power Dissipation @ Temperature Rise | |
|
Advanced Thermal Solutions Inc. |
193
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 21MM X 9.5MM
|
- | Thermal Tape, Adhesive (Included) | 0.3W @ 20°C | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 21X21X9.5MM W/OUT TIM
|
- | Thermal Tape, Adhesive (Not Included) | 0.3W @ 20°C | |||
|
|
Advanced Thermal Solutions Inc. |
18
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 21MM X 9.5MM
|
maxiGRIP | Clip, Thermal Material | - |
