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- Length：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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Descubre los productos 17
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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ASSMANN WSW Components |
1,723
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220/TOP-3/SOT-32
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.496" (38.00mm) | 1.359" (34.50mm) | Bolt On and PC Pin | SOT-32, TO-220, TOP-3 | - | - | 5.00°C/W | ||
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Advanced Thermal Solutions Inc. |
126
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 57.5 X 57.5 X 12.5MM
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maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 2.264" (57.50mm) | 2.264" (57.50mm) | Thermal Tape, Adhesive (Not Included) | ASIC | - | 2.30°C/W @ 200 LFM | - | |||
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CUI Inc. |
1,467
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 25
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HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 0.984" (25.00mm) | 1.359" (34.50mm) | PC Pin | TO-220 | 5.5W @ 75°C | 4.44°C/W @ 200 LFM | 13.64°C/W | ||
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Wakefield-Vette |
997
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3 dias |
-
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MOQ: 1 MPQ: 1
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ANCHOR HEATSINK 35X35X12.5MM
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Wave 3x | Board Level | Aluminum Alloy | Square, Angled Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | Clip | BGA | - | 3.63°C/W @ 200 LFM | - | ||
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Wakefield-Vette |
969
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3 dias |
-
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MOQ: 1 MPQ: 1
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ANCHOR HEATSINK 40X40X12.5MM
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Wave 4x | Board Level | Aluminum Alloy | Square, Angled Fins | 1.575" (40.00mm) | 1.575" (40.00mm) | Clip | BGA | - | 3.16°C/W @ 200 LFM | - | ||
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ASSMANN WSW Components |
961
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220/TOP-3/SOT-32
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.984" (25.00mm) | 1.359" (34.50mm) | Bolt On and PC Pin | SOT-32, TO-220, TOP-3 | - | - | 6.50°C/W | ||
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ASSMANN WSW Components |
326
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220/TOP-3/SOT-32
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.969" (50.00mm) | 1.359" (34.50mm) | Bolt On and PC Pin | SOT-32, TO-220, TOP-3 | - | - | 4.00°C/W | ||
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Advanced Thermal Solutions Inc. |
99
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 57.5 X 57.5 X 12.5MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 2.264" (57.50mm) | 2.264" (57.50mm) | Thermal Tape, Adhesive (Included) | ASIC | - | 2.30°C/W @ 200 LFM | - | |||
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CUI Inc. |
382
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 25
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HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 0.984" (25.00mm) | 1.378" (35.00mm) | PC Pin | TO-220 | 5.0W @ 75°C | 4.28°C/W @ 200 LFM | 15.00°C/W | ||
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Wakefield-Vette |
990
|
3 dias |
-
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MOQ: 1 MPQ: 1
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ANCHOR HEATSINK 23X23X12.5MM
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Wave 2x | Board Level | Aluminum Alloy | Square, Angled Fins | 0.906" (23.00mm) | 0.906" (23.00mm) | Clip | BGA | - | 6.76°C/W @ 200 LFM | - | ||
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CUI Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 27
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HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 1.063" (27.00mm) | 1.378" (35.00mm) | PC Pin | TO-220 | 6.0W @ 75°C | 3.64°C/W @ 200 LFM | 12.50°C/W | ||
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CUI Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 38
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HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 1.496" (38.00mm) | 1.359" (34.50mm) | PC Pin | TO-220 | 7.3W @ 75°C | 5.77°C/W @ 200 LFM | 10.27°C/W | ||
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CUI Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 38
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HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 1.496" (38.00mm) | 1.378" (35.00mm) | PC Pin | TO-220 | 7.4W @ 75°C | 3.94°C/W @ 200 LFM | 10.14°C/W | ||
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CUI Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 50
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HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 1.969" (50.00mm) | 1.378" (35.00mm) | PC Pin | TO-220 | 8.9W @ 75°C | 4.85°C/W @ 200 LFM | 8.43°C/W | ||
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CUI Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 50
|
HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 1.969" (50.00mm) | 1.359" (34.50mm) | PC Pin | TO-220 | 8.9W @ 75°C | 8.90°C/W @ 200 LFM | 8.43°C/W | ||
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CUI Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 63
|
HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 2.480" (63.00mm) | 1.378" (35.00mm) | PC Pin | TO-220 | 9.6W @ 75°C | 3.76°C/W @ 200 LFM | 7.81°C/W | ||
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CUI Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 63
|
HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 2.480" (63.00mm) | 1.359" (34.50mm) | PC Pin | TO-220 | 9.1W @ 75°C | 9.10°C/W @ 200 LFM | 8.24°C/W |
