- Length：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 31
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Length | Width | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Length | Width | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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CTS Thermal Management Products |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK FORGED 33 X 33 X 12MM
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APR | Square, Pin Fins | 1.283" (32.60mm) | 1.283" (32.60mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 3.80°C/W @ 200 LFM | - | ||
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CTS Thermal Management Products |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED WITH SMALL CLIP
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APR | Square, Pin Fins | 1.283" (32.60mm) | 1.283" (32.60mm) | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 3.80°C/W @ 200 LFM | - | ||
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CTS Thermal Management Products |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED WITH MEDIUM CLIP
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APR | Square, Pin Fins | 1.283" (32.60mm) | 1.283" (32.60mm) | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 3.80°C/W @ 200 LFM | - | ||
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CTS Thermal Management Products |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED WITH TALL CLIP
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APR | Square, Pin Fins | 1.283" (32.60mm) | 1.283" (32.60mm) | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 3.80°C/W @ 200 LFM | - | ||
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CTS Thermal Management Products |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED 38 X 38 X 12MM
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APR | Square, Pin Fins | 1.461" (37.10mm) | 1.461" (37.10mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 3.30°C/W @ 200 LFM | - | ||
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CTS Thermal Management Products |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED WITH SMALL CLIP
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APR | Square, Pin Fins | 1.461" (37.10mm) | 1.461" (37.10mm) | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 3.30°C/W @ 200 LFM | - | ||
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CTS Thermal Management Products |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED WITH MEDIUM CLIP
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APR | Square, Pin Fins | 1.461" (37.10mm) | 1.461" (37.10mm) | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 3.30°C/W @ 200 LFM | - | ||
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CTS Thermal Management Products |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED WITH TALL CLIP
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APR | Square, Pin Fins | 1.461" (37.10mm) | 1.461" (37.10mm) | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 3.30°C/W @ 200 LFM | - | ||
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CTS Thermal Management Products |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED 35X35X12MM
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APR | Square, Pin Fins | 1.366" (34.70mm) | 1.366" (34.70mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 3.50°C/W @ 200 LFM | - | ||
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CTS Thermal Management Products |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED 40X40X12MM
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APR | Square, Pin Fins | 1.560" (39.62mm) | 1.560" (39.62mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 2.80°C/W @ 200 LFM | - | ||
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CTS Thermal Management Products |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK FORGED W/ADHESIVE TAPE
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APR | Square, Pin Fins | 1.560" (39.62mm) | 1.560" (39.62mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 2.80°C/W @ 200 LFM | - |
