Descubre los productos 6
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Type Shape Length Width Attachment Method Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
507302B00000G
Aavid, Thermal Division of Boyd Corporation
18,195
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 2.5W LOW PROFILE
Board Level Square, Fins 0.750" (19.05mm) 0.750" (19.05mm) Bolt On 2.5W @ 60°C 10.00°C/W @ 200 LFM 24.00°C/W
ATS-PCB1021
Advanced Thermal Solutions Inc.
2,884
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 DUAL BLACK
Board Level Rectangular, Fins 1.470" (37.34mm) 1.750" (44.45mm) Bolt On - 3.00°C/W @ 200 LFM 9.60°C/W
7021B-MTG
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 TAB FOLD 42.16MM
Board Level, Vertical Rectangular, Fins 1.450" (36.83mm) 1.750" (44.45mm) Bolt On and PC Pin 6.0W @ 50°C 4.00°C/W @ 300 LFM 6.80°C/W
576012B00000G
Aavid, Thermal Division of Boyd Corporation
Consulta
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-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Board Level Rectangular, Fins 0.900" (22.86mm) 1.000" (25.40mm) Bolt On 2.0W @ 40°C 4.00°C/W @ 700 LFM 20.80°C/W
7021BG
Aavid, Thermal Division of Boyd Corporation
Consulta
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-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Board Level Rectangular, Fins 1.450" (36.83mm) 1.750" (44.45mm) Bolt On 6.0W @ 50°C 4.00°C/W @ 300 LFM 6.80°C/W
826002B05300
Comair Rotron
Consulta
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-
MOQ: 1  MPQ: 1
HEATSINK STAMP 9.7X44.5X36.8MM
Board Level, Vertical Rectangular, Fins 1.450" (36.83mm) 1.750" (44.45mm) Bolt On and PC Pin 3.0W @ 30°C 4.00°C/W @ 300 LFM -