Fabricante:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
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La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Shape Length Package Cooled Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow
ATS-PCB1042
Advanced Thermal Solutions Inc.
Consulta
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MOQ: 1  MPQ: 1
HEATSINK TO-220
Rectangular, Fins 1.644" (41.76mm) TO-220 - 3.50°C/W @ 200 LFM
575903B00000G
Aavid, Thermal Division of Boyd Corporation
Consulta
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MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Rhombus 1.630" (41.40mm) TO-3 7.0W @ 70°C 3.00°C/W @ 300 LFM