- Width:
-
- Attachment Method:
-
- Height Off Base (Height of Fin):
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Condiciones seleccionadas:
Descubre los productos 4
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | ||
ASSMANN WSW Components |
1,970
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK ANOD ALUM TO-220
|
- | Board Level, Vertical | Rectangular, Fins | 0.591" (15.01mm) | 0.504" (12.80mm) | PC Pin | 0.500" (12.70mm) | - | - | ||||
ASSMANN WSW Components |
2,400
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK ANOD ALUM TO-220
|
- | Board Level | Rectangular, Fins | 0.591" (15.01mm) | 0.425" (10.80mm) | PC Pin | 0.500" (12.70mm) | - | - | ||||
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level | Rectangular | 1.000" (25.40mm) | 0.750" (19.05mm) | Clip | 0.350" (8.89mm) | 1.0W @ 30°C | 16.00°C/W @ 200 LFM | ||||
CTS Thermal Management Products |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK VERT .85"H BLACK TO-220
|
7 | Board Level | Rectangular, Fins | 0.700" (17.78mm) | 0.780" (19.81mm) | Bolt On | 0.850" (21.60mm) | 2.0W @ 40°C | - |