- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
6,071
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/PINS 1.5"TALL
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Board Level, Vertical | 1.000" (25.40mm) | 1.650" (41.91mm) | Bolt On and PC Pin | 1.500" (38.10mm) | 10.0W @ 50°C | 3.70°C/W | ||
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Advanced Thermal Solutions Inc. |
2,884
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 DUAL BLACK
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Board Level | 1.470" (37.34mm) | 1.750" (44.45mm) | Bolt On | 0.380" (9.65mm) | - | 9.60°C/W | |||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | 1.500" (38.10mm) | 1.650" (41.91mm) | Bolt On and PC Pin | 1.000" (25.40mm) | 10.0W @ 50°C | 5.00°C/W |
