- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 5
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Material | Length | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Material | Length | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
7,732
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3 dias |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK .61" TO-220
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Aluminum | 1.159" (29.44mm) | Clip and PC Pin | 2.0W @ 40°C | 6.00°C/W @ 600 LFM | 13.60°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Aluminum | 1.159" (29.44mm) | Clip | 2.0W @ 40°C | 6.00°C/W @ 600 LFM | 13.60°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Aluminum | 1.159" (29.44mm) | Clip | 2.0W @ 40°C | 6.00°C/W @ 600 LFM | 13.60°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Aluminum | 1.159" (29.44mm) | Clip and PC Pin | 2.0W @ 40°C | 6.00°C/W @ 600 LFM | 13.60°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Copper | 1.025" (26.04mm) | Clip and PC Pin | 1.5W @ 40°C | 5.00°C/W @ 500 LFM | 20.00°C/W | Tin |
