- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- Condiciones seleccionadas:
Descubre los productos 2
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
Aavid, Thermal Division of Boyd Corporation |
4,063
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | 4.0W @ 20°C | 1.50°C/W @ 400 LFM | 2.70°C/W | ||||
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK MULTIWATT 2.5" BLK
|
677 | 6.0W @ 35°C | 2.20°C/W @ 200 LFM | - |