- Length:
-
- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Condiciones seleccionadas:
Descubre los productos 9
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
Aavid, Thermal Division of Boyd Corporation |
13,880
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 5W BLK
|
0.750" (19.05mm) | 0.500" (12.70mm) | Clip | 1.5W @ 40°C | 7.00°C/W @ 400 LFM | 27.30°C/W | ||||
Aavid, Thermal Division of Boyd Corporation |
15,923
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 VERT/HORZ MOUNT
|
0.600" (15.24mm) | 0.500" (12.70mm) | Clip | 1.0W @ 40°C | 16.00°C/W @ 200 LFM | 26.80°C/W | ||||
Aavid, Thermal Division of Boyd Corporation |
5,136
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK HORIZ PLUG-IN TO-220
|
0.750" (19.05mm) | 0.500" (12.70mm) | Clip and PC Pin | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | 27.30°C/W | ||||
Aavid, Thermal Division of Boyd Corporation |
10,548
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO220 CLIPON W/TAB.75"
|
0.748" (19.00mm) | 0.500" (12.70mm) | Clip and PC Pin | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | 27.30°C/W | ||||
Aavid, Thermal Division of Boyd Corporation |
18,071
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK MOD BLACK
|
0.750" (19.05mm) | 0.500" (12.70mm) | Clip | 1.5W @ 40°C | 7.00°C/W @ 400 LFM | 27.30°C/W | ||||
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
0.600" (15.24mm) | 0.500" (12.70mm) | Clip and PC Pin | 1.0W @ 40°C | 16.00°C/W @ 200 LFM | 26.80°C/W | ||||
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
0.850" (21.59mm) | 1.000" (25.40mm) | Clip | 2.0W @ 40°C | 9.00°C/W @ 200 LFM | 18.80°C/W | ||||
Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 19X12.8X12.7MM
|
0.750" (19.05mm) | 0.504" (12.80mm) | Clip | 1.0W @ 30°C | 8.00°C/W @ 300 LFM | - | ||||
Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 19X12.8X12.7MM
|
0.750" (19.05mm) | 0.504" (12.80mm) | Clip and PC Pin | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | - |