Fabricante:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Descubre los productos 8
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Type Length Attachment Method Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
ATS-PCB1002
Advanced Thermal Solutions Inc.
2,962
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220/TO262 CLIP W/TAB
Board Level, Vertical 0.748" (19.00mm) Clip and PC Pin - 10.20°C/W @ 200 LFM 27.30°C/W
ATS-PCB1066
Advanced Thermal Solutions Inc.
1,985
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220/TO-262 W/TAB
Board Level, Vertical 0.748" (19.00mm) Clip and PC Pin - 10.20°C/W @ 200 LFM 27.30°C/W
ATS-PCB1001
Advanced Thermal Solutions Inc.
1,867
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 CLIPON W/TAB
Board Level, Vertical 0.748" (19.00mm) Clip and PC Pin - 10.20°C/W @ 200 LFM 27.30°C/W
831502B00000
Comair Rotron
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK STAMP 19X12.8X12.7MM
Board Level 0.750" (19.05mm) Clip 1.0W @ 30°C 8.00°C/W @ 300 LFM -
831302B00000
Comair Rotron
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK STAMP 19X12.8X12.7MM
Board Level, Vertical 0.750" (19.05mm) Clip and PC Pin 1.0W @ 30°C 7.00°C/W @ 400 LFM -
831502B03700
Comair Rotron
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK STAMP 19X12.8X12.7MM
Board Level, Vertical 0.750" (19.05mm) Clip and PC Pin 1.0W @ 30°C 7.00°C/W @ 400 LFM -
831502B03900
Comair Rotron
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK STAMP 19X12.8X12.7MM
Board Level, Vertical 0.750" (19.05mm) Clip and PC Pin 1.0W @ 30°C 7.00°C/W @ 400 LFM -
831402B00000
Comair Rotron
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK STAMP 19X12.8X12.7MM
Board Level 0.750" (19.05mm) Clip and PC Pin 1.0W @ 30°C 7.00°C/W @ 400 LFM -