- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 5
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Aavid, Thermal Division of Boyd Corporation |
15,923
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 VERT/HORZ MOUNT
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Board Level | 0.600" (15.24mm) | Clip | 1.0W @ 40°C | 16.00°C/W @ 200 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
3,545
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/INSTALL TAB
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Board Level, Vertical | 0.750" (19.05mm) | Clip and Board Locks | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
9,752
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 CLIP-ON/TAB
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Board Level, Vertical | 0.600" (15.24mm) | Clip and PC Pin | 1.0W @ 40°C | 16.00°C/W @ 200 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | 0.600" (15.24mm) | Clip and PC Pin | 1.0W @ 40°C | 16.00°C/W @ 200 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | 0.750" (19.05mm) | Clip and PC Pin | 1.0W @ 30°C | 7.00°C/W @ 400 LFM |
