- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
-
- Condiciones seleccionadas:
Descubre los productos 6
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Comair Rotron |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 19X12.8X12.7MM
|
Board Level | 0.504" (12.80mm) | Clip | 1.0W @ 30°C | 8.00°C/W @ 300 LFM | ||
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Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 19X12.7X12.7MM
|
Board Level, Vertical | 0.500" (12.70mm) | Clip and PC Pin | 1.0W @ 40°C | 16.00°C/W @ 200 LFM | ||
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|
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Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 19X12.8X12.7MM
|
Board Level, Vertical | 0.504" (12.80mm) | Clip and PC Pin | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | ||
|
|
|
Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 19X12.8X12.7MM
|
Board Level, Vertical | 0.504" (12.80mm) | Clip and PC Pin | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | ||
|
|
|
Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 19X12.8X12.7MM
|
Board Level, Vertical | 0.504" (12.80mm) | Clip and PC Pin | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | ||
|
|
|
Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 19X12.8X12.7MM
|
Board Level | 0.504" (12.80mm) | Clip and PC Pin | 1.0W @ 30°C | 7.00°C/W @ 400 LFM |
