- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
Descubre los productos 14
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
42,175
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK VERT PLUG-IN TO-220
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Board Level, Vertical | 0.750" (19.05mm) | 0.500" (12.70mm) | Clip and PC Pin | 1.0W @ 30°C | 27.30°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
13,880
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 5W BLK
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Board Level | 0.750" (19.05mm) | 0.500" (12.70mm) | Clip | 1.5W @ 40°C | 27.30°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
14,905
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO220 CLIPON W/TAB.75"
|
Board Level, Vertical | 0.750" (19.05mm) | 0.500" (12.70mm) | Clip and PC Pin | 1.0W @ 30°C | 27.30°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
5,136
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK HORIZ PLUG-IN TO-220
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Board Level | 0.750" (19.05mm) | 0.500" (12.70mm) | Clip and PC Pin | 1.0W @ 30°C | 27.30°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
11,530
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO220 CLIPON W/TAB.75"
|
Board Level, Vertical | 0.750" (19.05mm) | 0.500" (12.70mm) | Clip and PC Pin | 1.0W @ 30°C | 27.30°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
3,545
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/INSTALL TAB
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Board Level, Vertical | 0.750" (19.05mm) | 0.500" (12.70mm) | Clip and Board Locks | 1.0W @ 30°C | 26.80°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
10,548
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO220 CLIPON W/TAB.75"
|
Board Level | 0.748" (19.00mm) | 0.500" (12.70mm) | Clip and PC Pin | 1.0W @ 30°C | 27.30°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
18,071
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK MOD BLACK
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Board Level | 0.750" (19.05mm) | 0.500" (12.70mm) | Clip | 1.5W @ 40°C | 27.30°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | 0.748" (19.00mm) | 0.500" (12.70mm) | Clip and PC Pin | 1.0W @ 30°C | 27.30°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | 0.750" (19.05mm) | 0.500" (12.70mm) | Clip and PC Pin | 1.0W @ 30°C | 26.80°C/W | ||
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Comair Rotron |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 19X12.8X12.7MM
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Board Level, Vertical | 0.750" (19.05mm) | 0.504" (12.80mm) | Clip and PC Pin | 1.0W @ 30°C | - | ||
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Comair Rotron |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 19X12.8X12.7MM
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Board Level, Vertical | 0.750" (19.05mm) | 0.504" (12.80mm) | Clip and PC Pin | 1.0W @ 30°C | - | ||
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Comair Rotron |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 19X12.8X12.7MM
|
Board Level, Vertical | 0.750" (19.05mm) | 0.504" (12.80mm) | Clip and PC Pin | 1.0W @ 30°C | - | ||
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Comair Rotron |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 19X12.8X12.7MM
|
Board Level | 0.750" (19.05mm) | 0.504" (12.80mm) | Clip and PC Pin | 1.0W @ 30°C | - |
