- Length：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Condiciones seleccionadas:
Descubre los productos 18
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Width | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Width | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
42,175
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK VERT PLUG-IN TO-220
|
Board Level, Vertical | 0.750" (19.05mm) | 0.500" (12.70mm) | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | 27.30°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
14,905
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO220 CLIPON W/TAB.75"
|
Board Level, Vertical | 0.750" (19.05mm) | 0.500" (12.70mm) | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | 27.30°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
5,136
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK HORIZ PLUG-IN TO-220
|
Board Level | 0.750" (19.05mm) | 0.500" (12.70mm) | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | 27.30°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
11,530
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO220 CLIPON W/TAB.75"
|
Board Level, Vertical | 0.750" (19.05mm) | 0.500" (12.70mm) | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | 27.30°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
10,548
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO220 CLIPON W/TAB.75"
|
Board Level | 0.748" (19.00mm) | 0.500" (12.70mm) | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | 27.30°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
9,752
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 CLIP-ON/TAB
|
Board Level, Vertical | 0.600" (15.24mm) | 0.500" (12.70mm) | 1.0W @ 40°C | 16.00°C/W @ 200 LFM | 26.80°C/W | ||
|
|
Advanced Thermal Solutions Inc. |
2,962
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220/TO262 CLIP W/TAB
|
Board Level, Vertical | 0.748" (19.00mm) | 0.504" (12.80mm) | - | 10.20°C/W @ 200 LFM | 27.30°C/W | |||
|
|
Advanced Thermal Solutions Inc. |
1,985
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220/TO-262 W/TAB
|
Board Level, Vertical | 0.748" (19.00mm) | 0.504" (12.80mm) | - | 10.20°C/W @ 200 LFM | 27.30°C/W | |||
|
|
Advanced Thermal Solutions Inc. |
1,867
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 CLIPON W/TAB
|
Board Level, Vertical | 0.748" (19.00mm) | 0.504" (12.80mm) | - | 10.20°C/W @ 200 LFM | 27.30°C/W | |||
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|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | 0.600" (15.24mm) | 0.500" (12.70mm) | 1.0W @ 40°C | 16.00°C/W @ 200 LFM | 26.80°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | 0.748" (19.00mm) | 0.500" (12.70mm) | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | 27.30°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | 0.750" (19.05mm) | 0.500" (12.70mm) | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | 26.80°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | 0.850" (21.59mm) | 1.000" (25.40mm) | 2.0W @ 40°C | 9.00°C/W @ 200 LFM | 18.80°C/W | ||
|
|
|
Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 19X12.7X12.7MM
|
Board Level, Vertical | 0.750" (19.05mm) | 0.500" (12.70mm) | 1.0W @ 40°C | 16.00°C/W @ 200 LFM | - | ||
|
|
|
Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 19X12.8X12.7MM
|
Board Level, Vertical | 0.750" (19.05mm) | 0.504" (12.80mm) | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | - | ||
|
|
|
Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 19X12.8X12.7MM
|
Board Level, Vertical | 0.750" (19.05mm) | 0.504" (12.80mm) | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | - | ||
|
|
|
Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 19X12.8X12.7MM
|
Board Level, Vertical | 0.750" (19.05mm) | 0.504" (12.80mm) | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | - | ||
|
|
|
Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 19X12.8X12.7MM
|
Board Level | 0.750" (19.05mm) | 0.504" (12.80mm) | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | - |
