- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Shape | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Shape | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Rectangular, Fins | TO-220 | 3.0W @ 60°C | 6.00°C/W @ 500 LFM | 20.40°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK TO-202 CLIP-ON 5W
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Rectangular | TO-202 | 1.0W @ 20°C | 8.00°C/W @ 200 LFM | 16.80°C/W |
