- Height Off Base (Height of Fin):
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
Descubre los productos 4
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | ||
Wakefield-Vette |
3,457
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK
|
0.250" (6.35mm) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | ||||
Wakefield-Vette |
3,025
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQBLK W/O TAPE
|
0.350" (8.89mm) | - | 3.00°C/W @ 800 LFM | ||||
Wakefield-Vette |
1,176
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQBLK W/O TAPE
|
0.450" (11.43mm) | 3.0W @ 50°C | 6.00°C/W @ 200 LFM | ||||
Wakefield-Vette |
4,276
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/OTAPE
|
0.598" (15.20mm) | 2.5W @ 30°C | 2.00°C/W @ 500 LFM |