Descubre los productos 3
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Width Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
501100B00000G
Aavid, Thermal Division of Boyd Corporation
13,233
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK 14-DIP/16-DIP
- 0.250" (6.35mm) 0.190" (4.83mm) 0.4W @ 30°C 30.00°C/W @ 500 LFM 67.00°C/W
651-B
Wakefield-Vette
4,555
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK 14-16PIN DIP BLK
651 0.415" (10.54mm) 0.240" (6.10mm) 0.5W @ 40°C 40.00°C/W @ 300 LFM -
501000B00000G
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
- 0.604" (15.34mm) 0.212" (5.39mm) 0.6W @ 40°C 60.00°C/W @ 100 LFM 60.00°C/W