- Height Off Base (Height of Fin):
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
Descubre los productos 3
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Width | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Width | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
Aavid, Thermal Division of Boyd Corporation |
13,233
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 14-DIP/16-DIP
|
- | 0.250" (6.35mm) | 0.190" (4.83mm) | 0.4W @ 30°C | 30.00°C/W @ 500 LFM | 67.00°C/W | ||||
Wakefield-Vette |
4,555
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 14-16PIN DIP BLK
|
651 | 0.415" (10.54mm) | 0.240" (6.10mm) | 0.5W @ 40°C | 40.00°C/W @ 300 LFM | - | ||||
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | 0.604" (15.34mm) | 0.212" (5.39mm) | 0.6W @ 40°C | 60.00°C/W @ 100 LFM | 60.00°C/W |