- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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TO-220 | 3.0W @ 60°C | 6.00°C/W @ 500 LFM | 20.40°C/W | ||
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|
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Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
TO-220 | 3.0W @ 60°C | 6.00°C/W @ 500 LFM | 20.40°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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TO-202 | 3.0W @ 50°C | 8.00°C/W @ 200 LFM | 16.80°C/W |
