- Series：
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- Length：
-
- Attachment Method：
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- Package Cooled：
-
- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 19
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
Advanced Thermal Solutions Inc. |
371
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 41X45X15MM NYLONPUSHPIN
|
maxiFLOW | Top Mount | 1.610" (40.89mm) | Push Pin | BGA | 0.590" (15.00mm) | 2.50°C/W @ 300 LFM | - | Green Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
147
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 50MM X 45MM X 15MM
|
maxiFLOW | Top Mount | 1.969" (50.00mm) | Thermal Tape, Adhesive (Not Included) | ASIC | 0.590" (15.00mm) | 2.80°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
1,014
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 50MM X 45MM X 15MM
|
maxiFLOW | Top Mount | 1.969" (50.00mm) | Thermal Tape, Adhesive (Included) | ASIC | 0.590" (15.00mm) | 2.80°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
148
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 41X45X25MM NYLONPUSHPIN
|
maxiFLOW | Top Mount | 1.610" (40.89mm) | Push Pin | BGA | 0.984" (25.00mm) | 1.60°C/W @ 300 LFM | - | Green Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
976
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 50MM X 45MM X 12.5MM
|
maxiFLOW | Top Mount | 1.969" (50.00mm) | Thermal Tape, Adhesive (Included) | ASIC | 0.472" (12.00mm) | 3.90°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
97
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 41X45X10MM PEM
|
maxiFLOW | Top Mount | 1.610" (40.89mm) | Push Pin | BGA | 0.394" (10.00mm) | 3.90°C/W @ 300 LFM | - | Green Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
73
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 41X45X10MM NYLONPUSHPIN
|
maxiFLOW | Top Mount | 1.610" (40.89mm) | Push Pin | BGA | 0.394" (10.00mm) | 3.90°C/W @ 300 LFM | - | Green Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
59
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 41X45X15MM BRASSPUSHPIN
|
maxiFLOW | Top Mount | 1.610" (40.89mm) | Push Pin | BGA | 0.590" (15.00mm) | 2.50°C/W @ 300 LFM | - | Green Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
53
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 41X45X15MM PEM
|
maxiFLOW | Top Mount | 1.610" (40.89mm) | Push Pin | BGA | 0.590" (15.00mm) | 2.50°C/W @ 300 LFM | - | Green Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
69
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 41X45X25MM BRASSPUSHPIN
|
maxiFLOW | Top Mount | 1.610" (40.89mm) | Push Pin | BGA | 0.984" (25.00mm) | 1.60°C/W @ 300 LFM | - | Green Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
76
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 50MM X 45MM X 16MM
|
maxiFLOW | Top Mount | 1.969" (50.00mm) | Thermal Tape, Adhesive (Not Included) | ASIC | 0.630" (16.00mm) | 2.10°C/W @ 200 LFM | - | Black Anodized | |||
|
|
|
Advanced Thermal Solutions Inc. |
27
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 50MM X 45MM X 16.5MM
|
maxiFLOW | Top Mount | 1.969" (50.00mm) | Thermal Tape, Adhesive (Included) | ASIC | 0.630" (16.00mm) | 2.10°C/W @ 200 LFM | - | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
82
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 41X45X10MM BRASSPUSHPIN
|
maxiFLOW | Top Mount | 1.610" (40.89mm) | Push Pin | BGA | 0.394" (10.00mm) | 3.90°C/W @ 300 LFM | - | Green Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
93
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 50MM X 45MM X 8.5MM
|
maxiFLOW | Top Mount | 1.969" (50.00mm) | Thermal Tape, Adhesive (Not Included) | ASIC | 0.335" (8.50mm) | 4.00°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
64
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 50MM X 45MM X 8.5MM
|
maxiFLOW | Top Mount | 1.969" (50.00mm) | Thermal Tape, Adhesive (Included) | ASIC | 0.335" (8.50mm) | 4.00°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
74
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 50MM X 45MM X 12.5MM
|
maxiFLOW | Top Mount | 1.969" (50.00mm) | Thermal Tape, Adhesive (Not Included) | ASIC | 0.472" (12.00mm) | 3.90°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
82
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 41X45X25MM PEM
|
maxiFLOW | Top Mount | 1.610" (40.89mm) | Push Pin | BGA | 0.984" (25.00mm) | 1.60°C/W @ 300 LFM | - | Green Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
77
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 45MM X 9MM
|
maxiGRIP | Top Mount | 0.827" (21.00mm) | Clip | Flip Chip Processors | 0.354" (9.00mm) | 6.10°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 DUAL BLACK
|
- | Board Level | 1.496" (38.00mm) | Bolt On | TO-220 | 0.984" (25.00mm) | 4.80°C/W @ 200 LFM | 7.20°C/W | Black Anodized |
