- Series:
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- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Thermal Resistance @ Forced Air Flow:
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- Material Finish:
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- Condiciones seleccionadas:
Descubre los productos 4
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Material Finish | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Material Finish | ||
Advanced Thermal Solutions Inc. |
201
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
1/4 BRICK HEATSINK 58X37X22.9MM
|
maxiFLOW | 2.283" (58.00mm) | Bolt On | Quarter Brick DC/DC Converter | 0.902" (22.90mm) | 1.60°C/W @ 200 LFM | Gold Anodized | ||||
Advanced Thermal Solutions Inc. |
88
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
1/4 BRICK HEATSINK 58X37X11.4MM
|
maxiFLOW | 2.283" (58.00mm) | Bolt On | Quarter Brick DC/DC Converter | 0.449" (11.40mm) | 4.30°C/W @ 200 LFM | Gold Anodized | ||||
Advanced Thermal Solutions Inc. |
69
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
1/4 BRICK HEATSINK 58X37X6.1MM
|
maxiFLOW | 2.283" (58.00mm) | Bolt On | Quarter Brick DC/DC Converter | 0.240" (6.10mm) | 12.10°C/W @ 200 LFM | Gold Anodized | ||||
Advanced Thermal Solutions Inc. |
52
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 29MM X 37MM X 10MM
|
maxiGRIP | 1.142" (29.01mm) | Clip | Flip Chip Processors | 0.394" (10.00mm) | 6.20°C/W @ 200 LFM | Black Anodized |