- Series：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | |
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Advanced Thermal Solutions Inc. |
139
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 15MM X 15MM X 9MM
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maxiFLOW | 0.590" (14.99mm) | 0.590" (14.99mm) | Thermal Tape, Adhesive (Not Included) | ASIC | 0.354" (9.00mm) | |||
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Advanced Thermal Solutions Inc. |
444
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 9MM
|
maxiFLOW | 0.590" (14.99mm) | 0.590" (14.99mm) | Thermal Tape, Adhesive (Included) | ASIC | 0.354" (9.00mm) | |||
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Advanced Thermal Solutions Inc. |
33
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 21MM X 9.5MM
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maxiGRIP, maxiFLOW | 0.827" (21.00mm) | 0.827" (21.00mm) | Clip, Thermal Material | BGA | 0.374" (9.50mm) |
